Differential measurement probe having a ground clip system for the probing tips

ABSTRACT

A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

CROSS-REFERENCE TO RELATED APPLICATION

This divisional application claims the benefit of priority of divisionalU.S. patent application No. 11/689,415, filed Mar. 21, 2007, now U.S.Pat. No. 7,436,191, which claim the benefit of priority of the U.S.patent application No. 11/139,315, filed May 27, 2005 now abandoned .

BACKGROUND OF THE INVENTION

The present invention related generally to differential measurementprobes and more particularly to a differential measurement probe havingground clip system for probing tips that move axially and/or laterallyrelative to each other.

Differential measurement probe have first and second probing tipextending from a probe body for acquiring differential signals from adevice under test or for acquiring a single signal with the secondprobing tip connected to a ground node of the test device. As the speedof electronic signal increases, inductive and capacitive effects thatwere negligible at lower bandwidths become increasing important.Inductive ground loops are one effect that can limit the bandwidth of adifferential measurement probe. As the bandwidth of differentialmeasurement probes approach 20 GHz, there is a need to reduce inductiveground loops as much as possible.

In a related application, the increasing speeds of electronic signalshas resulted in the need for transmission line structures in printedcircuit board (PCB) designs. To optimize high performance PCB designsfor high speed applications, smooth transmission line structures areneed to link communications between components. Time domainreflectometry (TDR) probes launch a rising or falling edge signal ontotransmission line structures on a printed circuit board and acquire thereturn signal from the transmission line structures for determiningparameters of the transmission lines. For example, the verifying theintegrity of a transmission line structure can be determined using a TDRprobe and a sampling oscilloscope.

Although instruments for differential TDR measurements are in existence,the limitations of commercially available TDR probes has resulted in PCBmanufacturers having to rely upon test structures laid out on testcoupons that are placed along the periphery of the PCB flat for PCBtransmission line impedance control measurements. TDR data from the testcoupon is used for determining lot quality for accepting or rejectingthe circuit boards. This has lead to rejecting marginally good boardsand allowing marginally bad boards because the test coupon may be faraway from the actual transmission lines of interest. Correlation studiesbetween system speed and transmission line designs are typically basedon the test coupon results. Because of the difficulty in controlling thelaminate layer thicknesses, the dielectric constant variations, metalline photo edge definitions and the copper etching over large boardareas, there is usually sizable variations in the impedance oftransmission lines depending on the their board location. Thenon-uniformity between transmission lines is typically on the order often percent. Due to these problems, correlation studies for highperformance differential transmission lines to board impedance oftenrequires large quantities of samples to reveal the true relationship.

Another problem a user encounter when performing differential TDR testis the need to provide a good ground for the two differential signallines. Typically when performing differential signal measurements on aprinted circuit board, a coplanar probe pad arrangement is required. Thegeneral probe pad arrangements are ground-signal-signal-ground (G-S-S-G)or a ground-signal-ground-signal-ground (G-S-G-S-G). This is a veryrestrictive requirement because the line spacing and line width ofdifferential pairs are of may different varieties depending on thedevice pin pitch, PCB board materials, desired loss limit, and the like.A differential TDR probe has to be able to accommodate these differentfeature sizes.

An example of a TDR probe is the CP400-04, manufactured by Candox Systemof Japan. The probe has a metal housing in which an insulated signalconductor is disposed. The metal housing has a threaded connector at oneend for connecting a signal cable. The other end of the housing hasapertures for receiving spring action pogo pins. One pogo pin is coupledto the insulated signal conductor and the other pogo pins are connectedto the metal housing. The resulting probing tips have a GSGconfiguration with 2.5 millimeter center-to-center spacing between thepogo pins.

A further example is the A0131688 TDR Probe, manufactured and sold byInter-Continental Microwave, Santa Clara, Calif. The TDR probe has ametallic housing with one end of the housing having a threaded connectorfor connecting a signal cable. A substantially rectangular memberextends outward from below the connector and has a threaded aperture forreceiving a screw that secures the TDR probe to the flat spring when theTDR probe is configured with a similar probe for differential TDRapplications. Below the rectangular member is a circular portion thattransitions into a narrow rectangular probe tip member. The probe tipmember has an aperture that receives an RF pin and dielectric member.The RF pin is electrically connected to a central signal contact of thetreaded connector. Additional apertures are formed in the narrowrectangular probe tip member for receiving ground pogo pins. The variousapertures allow the ground pogo pins to be positioned at variousdistances from the RF pin. The resulting probing tip has a GSGconfiguration.

Two A0131688 TDR Probes are used to produce the A0134332 DifferentialTDR probe, manufactured and sold by Inter-Continental Microwave, SantaClara, Calif. The individual TDR probes that are mounted to a flatspring using two screws. A variable spacing adjustment clamp is positionover the TDR probes adjacent to the narrow rectangular probe tipmembers. The adjustment clamp has a “U” shaped portion and a flatportion with the two portions being secured together with screws. Thetwo opposing sides of the “U” shaped member have threaded apertures thatreceive adjustment cap screws that extend through the sides of the “U”shaped member and into interior space of the “U”. Treaded apertures areformed in the base of the “U” shaped member that intersect the threadedapertures in the opposing sides of the “U” shaped member. Each threadedaperture in the base receives a set screw that is tightened on theadjustment cap screws.

Positioning of the RF pins are accomplished by loosening the set screwson the adjustment cap screws and turning the adjustment cap screws tomove each TDR probes closer together or farther apart. The flat springto which the TDR probes are attached causes outward pressure on theprobes to force them against the adjustment cap screws. The screwsholding the TDR probes to the flat spring may also be loosened to allowrotational movement of the probes. When the RF tip and the ground pogopins are positioned correctly, the set screws and the flat spring screwsare tightened.

U.S. Pat. No. 6,734,689 describes a measurement probe providing signalcontrol for an EOS/ESD protection control module. The measurement probehas a spring loaded coaxial probe assembly and a pressure sensor thatwork in combination to provide an activation signal to the controlmodule. The control module is coupled to a TDR module in a samplingoscilloscope that provides the rising or falling edge signal to the DUTand samples the return signal from the DUT. The spring loaded coaxialcable assembly and pressure sensor are disposed in a probe housing. Thespring loaded coaxial probe assembly has a semi-rigid coaxial cable withone end forming a probing tip and the other end having a threadedconnector. A flexible coaxial cable is connected to the threadedconnector and to the control module. A ground probing tip is disposedadjacent to the probing tip and is electrically coupled to the outershielding conductor of the semi-rigid coaxial cable. The ground probingtip is a retractable, spring loaded probing tip that is attached to aslotted collar that fits around outer shielding conductor of thesemi-rigid coaxial cable. The resulting probe has a GS configuration.

What is needed is a differential measurement probe that reducesinductive ground loops for achieving a 20 GHz probe bandwidth. Further,there is a need for a variable spacing differential TDR probe that isnot limited to existing ground-signal-ground configurations. Thevariable spacing differential TDR probe should be provided with a groundclip system that couples the outer shielding conductors of the coaxialprobing tips together during all possible axial and lateral movements ofthe coaxial probing tips.

SUMMARY OF THE INVENTION

Accordingly, the present invention is a differential measurement probehaving first and second probing tip assemblies disposed within ahousing. Each of the first and second probing tip assemblies have aprobing tip extending from one end of the housing with each probing tipassembly having a probing contact and an outer shielding conductorcoupled to a probe ground. A ground clip is coupled between the outershielding conductors of the first and second probing tips adjacent tothe probing contacts of the first and second probing tips.

On one embodiment of the differential measurement probe, each of theprobing tip assemblies has at least a first compressible elementdisposed within the housing for allowing independent axial movement ofthe first and second probing tip assemblies. In a further embodiment,the differential measurement probe has at least a first adjustmentmechanism coupled to one of the first and second probing tip assembliesfor varying the distance between the probing tips of the first andsecond probing tip assemblies.

In a further embodiment, a ground clip system electrically couples theshielding conductors of first and second measurement probing tipstogether in a differential measurement probe. The measurement probingtip extend from one end of the differential measurement probe and lay ina common vertical plane with the first and second measurement probingtips move axially and laterally relative to each other. The ground clipsystem has a circular spring wire having a lateral section thattransitions into a vertical section at one end and an angled section atthe other end. The angled section extends in the opposite direction fromthe vertical section and has an obtuse angle to the lateral section. Ina first embodiment, the lateral, vertical and angled sections of thecircular spring wire are in the same plane. A protruding section extendsupward from the end of the angled section with the protruding sectionhaving an acute angle to the to the plane of the lateral, vertical andangled sections. A flattened wire section extends from the end of theprotruding section with the flattened section extending toward the planeof the lateral, vertical and angled sections of the circular springwire. The flattened section has an obtuse angle relative to the lateralsection of the circular spring wire and an acute angle relative to theplane of the lateral, vertical and angled sections of the circularspring wire.

An angled bore is formed in the end of the differential measurementprobe and receives the vertical section of the circular spring wire. Theangle of the bore extends toward the common vertical plane of the firstand second measurement probing tips. A protrusion having side surfacesextends upward from the end of the differential measurement probeadjacent to one of the measurement probing tips. The end of the lateralsection of the circular spring wire adjacent to the angled section ofthe circular spring wire abuts the surface of the protrusion facing themeasurement probing tip. The junction of the angled section and theprotruding section of the circular spring wire engages one of theshielding conductors of the first and second measurement probing tipsand the flattened portion of the circular spring wire engages theshielding conductor of the other of the first and second measurementprobing tips.

In the preferred embodiment, the transition between the lateral andvertical sections of the circular spring wire is substantially ninetydegree. The obtuse angle between the lateral and angled sections of thecircular spring wire has a range of ninety-two and ninety-six degrees.The angle between the protruding section of the circular spring wire andthe plane of the lateral, vertical and angled sections of the circularspring wire has a range of thirty-five to sixty-five degrees. Theprotruding section of the circular spring wire has an inside length of0.010 inches. The flattened section of the circular spring wire has athickness in the range of 0.004 inches to 0.007 inches. The obtuse angleof the flattened section of the circular spring wire to the lateralsection of the circular spring wire is in the range ninety-two toninety-five degrees. The acute angle of the flattened section of thecircular spring wire to the relative to the plane of the lateral,vertical and angled sections of the circular spring wire lateral sectionof the circular spring wire is in the range eight to fifteen degrees.The angle of the bore extending toward the common vertical plane of thefirst and second measurement probing tips is twenty degrees.

In a further embodiment of the invention, the lateral section defines aplane and at least one of the vertical section and the angled section ofthe circular spring wire is at an acute angle to the lateral sectionplane. The bore formed in the end of the differential measurement probeis parallel to the common vertical plane of the first and secondmeasurement probing tips and receives the vertical section of thecircular spring wire. In one implementation, the acute angle of thevertical section of the circular spring wire is at twenty degrees to thelateral section plane. In another implementation, the acute angle of theangled section of the circular spring wire is at twenty degrees to thelateral section plane. In a further embodiment, the vertical section ofthe circular spring wire and the angled section of the circular springwire are angled to the lateral section plane with the total angle of thevertical section of the circular spring wire and the angled section ofthe circular spring wire being at twenty degrees to the lateral sectionplane.

The objects, advantages and novel features of the present invention areapparent from the following detailed description when read inconjunction with appended claims and attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a differential measurement probe havinga ground clip system according to the present invention.

FIG. 2 is a partially exploded perspective view of the differentialmeasurement probe having a ground clip system according to the presentinvention.

FIG. 3 is a perspective view of a differential TDR measurement probehaving a ground clip system according to the present invention.

FIG. 4 is a partially exploded view of the differential TDR measurementprobe having a ground clip system according to the present invention.

FIG. 5 is close-up perspective view of the front end of the differentialTDR measurement probe having a ground clip system according to thepresent invention.

FIG. 6 is a side view and a plan view of the spring wire member of theground clip system according to the present invention

FIG. 7 is a simplified end view of the probing tip assemblies and aportion of the ground clip system according to the present invention.

FIGS. 8A and 8B are side views of alternative configurations of thespring wire member in the ground clip system according to the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 1, there is a perspective view of a differentialmeasurement probe 10 having a ground clip system 12 coupled to outershielding conductors 14, 16 of probing tips 18, 20. Each probing tip 18,20 has a probing contact 22, 24 centrally disposed in the probing tip18, 20. The probing tips 18, 20 extend outward from a housing 26. Thedifferential measurement probe 10 may be part of a measurement probingsystem such as described in co-pending U.S. patent application Ser. No.11/139,103, filed concurrently herewith and incorporated by reference.The measurement probing system includes a probe body electricallycoupled to a measurement test instrument, such as an oscilloscope or thelike, via a coaxial cable. The coaxial cable also contains power andsignal lines that provide electrical power to active circuitry in theprobe body and communication signals to and from the probe body forcontrolling the active circuitry. Two coaxial cables extends from theprobe body through an inverted strain relief and is coupled to adifferential measurement probe 10. The probing tips 18, 20 are part offirst and second probing tip assemblies 28, 30 disposed in the housing26 as best shown by the partially exploded perspective view of FIG. 2.

The housing 26 has first and second housing members 32, 34 formed of aninsulating material, such as ABS plastic, polycarbonate, or the like.The probing tip assemblies 28, 30 may be formed from flexible semi-rigidcoaxial cables 36, 38, such as manufactured and sold by Tensolite,Corp., St. Augustine, Fla., under the trade name Semi-Flex®. TheSemi-Flex has a central signal conductor and an tightly braised outershielding conductor formed of an electrically conductive material thatis covered with an insulating material 40. A portion of the outerinsulating material 40 is removed from the cables 36, 38 and the exposedbraided portions of the outer shielding conductors are dipped in aliquid solder. The solder flows into the braids and stiffen thoseportions of the cables to form an unbending semi-rigid coaxial cables44, 46. The unbending semi-rigid coaxial cables 44, 46 forms the probingtip assemblies 28, 30 with the solid outer shielding conductors formingthe outer shielding conductors 14, 16 of the probing tip assemblies 28,30. The probing contacts 22, 24 of the probing tips 18, 20 arepreferably secured to respective resistive elements 48, 49 that areelectrically coupled to the center signal conductors of the semi-rigidcoaxial cables 44, 46. In a further embodiment, the semi-rigid coaxialcables 44, 46 may traditional semi-rigid coaxial cables having solidouter shielding conductors. The outer shielding conductors 14, 16 of thesemi-rigid coaxial cables are coupled to electrical ground through theelectrical circuitry of the probe body.

The first and second probing tip assemblies 28, 30 have firstcompression springs 50, 52 positioned on the respective semi-rigidcoaxial cables 44, 46. One end of each of the first compression springs50, 52 are fixedly positioned on the semi-rigid coaxial cables 44, 46.In one implementation, the spring ends abut respective retention plates54 that are secured to the outer shielding conductors 14, 16 of thesemi-rigid coaxial cable 44, 46. The opposing side of the retentionplate 54 abuts a transverse wall 56 in the housing 26. The other ends ofthe first compression springs 50, 52 abut a transverse wall 58 such thatthe first compression springs 50, 52 are compressed between thetransverse walls 56 and 58.

The first and second probing tip assemblies 28, 30 have secondcompressive springs 60, 62 positioned on the semi-rigid coaxial cables44, 46. One end of each of the second compression springs 60, 62 abutrespective pressure plates 64 having bores 66 there through forpositioning the pressure plates 64 around the semi-rigid coaxial cable44, 46. The pressure plates 64 are free to move along the semi-rigidcoaxial cables 44, 46. The pressure plates 64 abut a transverse wall 68.The other ends of the second compression springs 60, 62 abut atransverse wall 70 such that the second compression springs 60, 62 arecompressed between the transverse walls 68, 70. Actuators 72 are fixedlypositioned on the outer shielding conductors 14 of the semi-rigidcoaxial cables 44, 46 with the actuators having protrusions 74 extendingtoward the pressure plates 64. The protrusions 74 of the actuators 72pass through apertures 76 formed in the transverse wall 68 and engagethe pressure plates 64 during movement of the housing 26 relative to theprobing tip assemblies 28, 30. The first and second compressible springs50, 52, 60, 62 allow independent axial movement of the probing tipassemblies 28, 30 within the housing 26 during use.

The ground clip system 12 may be formed of a flexible braided copper 80that is plated with silver. The silver plated braided copper 80 issecured to the outer shielding conductors 14, 16 of probing tips 18, 20using solder, electrically conductive epoxy or the like. The silverplated braided copper 80 has sufficient length and flexibility to allowthe maximum travel of the independently movable probing tip assemblies28, 30 within the housing 26.

Referring to FIG. 3, there is shown a perspective view of a differentialTDR measurement probe 100 incorporating the ground clip system 102. TheTDR measurement prob 100 has a housing 104 in which are disposed firstand second probing tip assemblies to be described in greater detailbelow. The housing 104 is preferably elongate with a predominaterectangular cross-section and made of first and second member 114 116.The housing 104 is formed of an insulating material, such as ABSplastic, polycarbonate, or the like. Extending from one end of thehousing 104 are probing tips 106, 108. Extending from the far end of thehousing are coaxial threaded connectors 110, 112 that are coupled toflexible coaxial cables (not shown). The coaxial cables connect thedifferential TDR measurement probe 100 to first and second controlmodules (not shown) providing electrical overstress (EOS) andelectrostatic discharge (ESD) protection. The first and second controlmodules couple the signals from the differential TDR measurement probe100 to a TDR sampling module in a sampling oscilloscope (not shown).

Referring to FIG. 4, the housing member 114 has first and secondchannels 118, 120 for receiving the first and second coaxial probeassemblies 122, 124. Each of the coaxial probe assemblies 122, 124 has asemi-rigid coaxial cable 126 having a central signal conductor 128 andan outer shielding conductor 130. The central signal conductors 128extend outward past the outer shielding conductors 130 at one end toform the probing tips 106, 108. The semi-rigid coaxial cables 126 havecurved portions 132 at the probing tip ends 106, 108 that transitions tostraight portions at the probing tips 106, 108. The coaxial threadedconnectors 110, 112 are attached to the other ends of the semi-rigidcoaxial cables 126. The threaded portions of the coaxial threadedconnectors 110, 112 are coupled to the outer shielding conductors 130and the central signal conductors 128 are coupled to respective centralconductors axially disposed within the coaxial threaded connectors 110,112. The outer shielding conductors 130 of the semi-rigid coaxial cables126 are capable of being coupled to electrical ground through theflexible coaxial connectors 110, 112 being coupled to the flexiblecoaxial cables that are connected to the first and second controlmodules in the sampling oscilloscope. Attachment plates 134 are attachedto the outer shielding conductors 130 adjacent to the coaxial threadedconnectors 110, 112. Abutting the attachment plates 134 on the side awayfrom the coaxial threaded connectors 110, 112 are anti-rotation block136, 138. Each anti-rotation block 136, 138 has a channel 140 formedtherein that accepts one of the semi-rigid coaxial cables 26. Theanti-rotation blocks 136, 138 have threaded apertures that receivethreaded screws passing through apertures formed in the attachmentplates 134 for securing the anti-rotation blocks 136, 138 to theattachment plates 134.

The first and second coaxial probe assemblies 122, 124 have firstcompressive elements 146, 148 in the form of compression springs 150positioned on the semi-rigid coaxial cables 126. One end of thecompression springs 150 are preferably held in place on the semi-rigidcoaxial cables 126 by a compression spring retention members 152 securedto outer shielding conductors 130 of the semi-rigid coaxial cables 126.The other ends of the compression springs 150 are free to move along thesemi-rigid coaxial cables 126. A pressure plate 154 in the form of awasher is preferably positioned adjacent to each of the free ends of thecompression springs 150 for engaging the rearward end walls 156, 158 ofthe channels 118, 120. The first and second coaxial probe assemblies122, 124 have respective second compressive elements 160, 162 in theform of compression springs disposed within pogo pins 164, 166, 168. Thecompression springs are partially compressed in the pogo pins 164, 166,168 by the movable electrical contacts 170, 172, 174 of the pogo pins.

The first coaxial probe assembly 122 has a first pressure sensor 180that includes first and second electrically conductive contacts 182 and184. The first electrically conductive contact 182 is positioned on thesemi-rigid coaxial cable 126 and the second electrically conductivecontact 184 is positioned in the housing member 1114. The electricallyconductive contact 182 preferably takes the form of a rectangular shapedretention block 186 having a curved slot 188. The curved portion 132 ofthe semi-rigid coaxial cable 126 of the first coaxial probe assembly 122is disposed in the curves slot 188 of the retention block 186 and makeselectrical contact with the retention block 186. The retention block 186is preferably made of an electrically conductive material, such ascopper, brass, or the like, that is plated with gold. The secondelectrically conductive contact 184 is the pogo pin 164 of the secondcompressive element 160 of the first coaxial probe assembly 122.

The second coaxial probe assembly 124 has a second pressure sensor 190that includes first and second electrically conductive contacts 192 and194. The first electrically conductive contact 192 is positioned on arectangular shaped retention block 196 having a curved slot 198. Thecurved portion 132 of the semi-rigid coaxial cable 126 of the secondcoaxial probe assembly 124 is disposed in the curves slot 198 of theretention block 196 and makes electrical contact with the retentionblock 196. The retention block 196 is preferably made of an electricallyconductive material, such as copper, brass, or the like, that is platedwith gold. An electrically insulating material 200 is disposed betweenthe electrically conductive contact 192 and the retention block 196 toelectrically isolate the contact 192 from the coaxial probe assembly126. The second electrically conductive contact 194 of the secondpressure sensor 190 is the two pogo pins 166, 168 of the secondcompressive element 162 of the second coaxial probe assembly 124.

The differential TDR measurement probe 100 has an adjustment mechanism210 that moves the first coaxial probe assembly 122 relative to thesecond coaxial probe assembly 124 which, in turn, varies the spacingbetween the probing tips 106, 108. The adjustment mechanism has acarrier 212 closely receiving the retention block 186 of the firstcoaxial probe assembly 122. The carrier 212 is preferably a “U” shapedmember having a threaded aperture formed therein for receiving athreaded cap screw 214 having a cap head 216 and the threaded shank 218.The threaded cap screw 214 is inserted in a bore 220 of the housingmember 114 with the threaded shank 218 extending into a recess 222 ofthe channel 118 and screwing into the carrier 212. The cap head 216 ofthe cap screw 214 sits in a recess formed in the outer surface of thehousing member 114. A cap plate 224 fits over this recess and is held inplace with a screw 226 that is screwed into the housing member 114. Thecap plate 224 closely captures the cap head 216 between the housingmember 114 and the cap plate 224 so that there is no axial movement ofthe cap head 216 in the recess.

The retention block 186 frictionally fits in the “U” shaped carrier 212so that there is no lateral play of the retention block 186 in thecarrier 212. The carrier 212 is positioned in a recess 230 of thechannels 118 of the housing member 114 and moves laterally across therecess 230 in response to the turning of the cap screw 214. Turning thecap screw 214 clockwise generates pressure to the bottom surface of thecap head 216 by the housing member 114 causing the carrier 212 to moveoutward towards the side of the housing member 114. Turning the capscrew 214 counter clockwise generates pressure on the top of the caphead 216 by the cap plate 224 causing the carrier 212 to move inwardtoward the center of the housing member 114. The carrier 212 can retractinto the recess 222 formed in the wall of the housing member 114 untilthe retention block 186 abuts the outer side wall of the recess 230. Thecarrier 212 can be extended across the recess 230 until the retentionblock 186 abuts the inner side wall of the of the recess 230 with aportion of the carrier 212 moving into a slot 232 formed in the dividingwall 234 between the channels 118 and 120.

Placing the probing tips 106, 108 on a transmission line structure on aprinted circuit board and applying downward pressure on the housing 104applies downward forces on the probing tips 106, 108 by the firstcompression springs 150 being compressed by the rearward end walls 156,158 of the channels 118, 120 in the housing 104. At the same time, theprobing tips 106, 108 begin to retract into the housing 104. Continueddownward pressure on the housing 104 causes the probing tips 106, 108 tocontinue to retract in the housing and the pogo pins 164, 166, 168 ofthe second electrically conductive contacts 184, 194 of the first andsecond pressure sensors 180 and 190 to engage the first electricallyconductive contacts 182, 184 of the first and second pressure sensors180, 190. The making of the contacts of the first and second pressuresensors 180, 190 passes an activation signal to the control moduleswhich activates a relay to couple the probing tips 106, 108 to the TDRsampling module. At the same time, the compression springs in the pogopins 164, 166, 168 apply additional downward forces to the probing tips106, 108. The use of the first and second compressive elements 146, 148,160, 162 with the first and second coaxial probe assemblies 122, 124allows the assemblies to move independently of each other.

Referring to FIG. 5, there is a close-up perspective view of the frontend of the differential TDR measurement probe 100 showing the groundclip system 92. The probing tips 106, 108 lay in a common plane 248 thatis normal to the front end of the differential TDR measurement probe100. The ground clip system 92 has a spring wire member 250, a bore 252formed in the end of the differential TDR measurement probe 100, and aprotrusion 254 extending from the end of the differential TDRmeasurement probe 100. In the preferred embodiment, the bore 252 and theprotrusion are formed in the retention block 196 of the second coaxialprobing assembly 124. The bore 252 is preferably angled toward theprobing tip 108 at twenty degrees but other angles may be employed solong as the spring wire member maintains contact with the outershielding conductors 130 of the probing tips 106, 108 at all times. Athreaded bore is formed in the retention block 196 for receiving a capscrew 258 for securing the spring wire member 250 to the differentialTDR measurement probe 100. The spring wire member 250 has various angledbends and a flat portion formed therein for allowing the spring wiremember 250 to contact the outer shielding conductors 130 of the probingtips 106, 108 at any spacing between the probing tips 106, 108.

Referring to FIG. 5, there is a close-up perspective view of the frontend of the differential TDR measurement probe 100 showing the groundclip system 102. The probing tips 106,108 lay in a common plane 248 thatis normal to the front end of the differential TDR measurement probe100. The ground clip system 102 has a spring wire member 250, a bore 252formed in the end of the differential TDR measurement probe 100, and aprotrusion 254 extending from the end of the differential TDRmeasurement probe 100. In the preferred embodiment, the bore 252 and theprotrusion are formed in the retention block 196 of the second coaxialprobing assembly 124. The bore 252 is preferably angled toward theprobing tip 108 at twenty degrees but other angles may be employed solong as the spring wire member maintains contact with the outershielding conductors 130 of the probing tips 106,108 at all times. Athreaded bore is formed in the retention block 196 for receiving a capscrew 258 for securing the spring wire member 250 to the differentialTDR measurement probe 100. The spring wire member 250 has various angledbends and a flat portion formed therein for allowing the spring wiremember 250 to contact the outer shielding conductors 130 of the probingtips 106,108 at any spacing between the probing tips 106, 108.

Extending from the end of the angled section 264 is a protruding section268 and a flattened section 270. The protruding section 268 extendsoutward from the plane 266 at an nominal angle of approximatelyforty-five degrees. The protruding section 268 has a nominal insidedimension of 0.010 inches for probing tips 106, 108 having a diameter of0.085 inches. The inside dimension of the protruding section 268 varieswith the diameter of the probing tips 106, 108 with lager diameterprobing tips 106, 108 requiring a larger inside dimension for theprotruding section 268. The flattened section 270 extends from theprotruding section 268 and is angled toward the common plane 266 of thelateral section 260, the substantially vertical section 262 and theangled section 264. The angle of the flattened section 270 relative tothe common plane 266 has a range of eight to fifteen degrees with thenominal angle being eight degrees. The flattened section 270 further hasan obtuse angle relative to the lateral section 260 that ranges from twoto four degrees with the nominal angle being two degrees. The flattenedsection 270 has a thickness ranging from 0.0045 to 0.0060 inches and anoverall nominal length of 0.260 inches. The flattening of theberyllium-copper wire lowers the spring constant of that flattenedsection 270 of the wire normal to the flat surface. This lowers thetorsion force the flattened section 270 exerts on the junction 272 ofthe angled section 264 and the protruding section 268. After the springwire member 250 is formed into the proper shape, it is heat treated at600° F. for two hours to increase the hardness of the beryllium copperwire.

The substantially vertical section 262 of the spring wire member 250 isinserted into the angled bore 252 with the lateral section 260 layingflush with the surface of the retention block 196 and the end of thelateral section 260 adjacent to the angled section 264 positionedagainst the inside surface of the protrusion 254 adjacent to the probingtips 108. The junction 272 of the angled section 264 and the protrudingsection 268 abuts the outer shielding conductor 130 of the probing tip108. Because of the twenty degree angle applied to the angled section264 by the spring wire member 250 being inserted into the angled bore252, the lateral section 260 has the tendency to spring outward from theprobing tip 108. The protrusion 254 retrains the lateral section 260from springing outward so as to maintain a strong spring force of thejunction 272 on the outer shielding conductor 130 of the probing tip 108as represented by the vector F₁ in FIG. 7.

FIG. 7 is a simplified end view of the probing tip assemblies 106, 108looking toward the end of the differential TDR measurement probe 100.The probing tip 106 is movable relative to the probing tip 108 asrepresented by the doubled arrow dashed line. The flattened section 270of the spring wire member 250 engages the outer shielding conductor 130of the probing tip 106. When the probing tips 106, 108 are separated attheir greatest distance from each other, the junction 272 of the angledsection 264 and the protruding section 268 is positioned toward theprobing tip 106 on the outer shielding conductor 130 of the probing tip108. At the same time the obtuse angle between the lateral section 260and the angled section 264 increases. The spring constant of theberyllium copper wire seeks to maintain the original obtuse angle whichgenerates a force F₂ on the junction 272 as represented by the vectorF₂. The resulting vector force on junction 272 is directed toward thecentral signal conductor 128 of the probing tip 108.

As the probing tip 106 is moved toward the probing tip 108, the junction272 of the spring wire member 250 moves along the surface of the outershielding conductor 130 of the probing tip 108 as represented by thedashed probing tips 106, the flattened section 270 and the protrudingsection 268. The flattened section 270 of the spring wire member 250 hasa reduce spring constant compared to the circular portions of the springwire member 250 due to the flattening process. Because of this, thetorsional force applied by the flattened section 270 on the junction 272is reduced. This results in the junction 272 maintaining a strongmechanical contact with the outer shielding conductor 130 of the probingtip 108. Without the reduced spring constant of the flattened section270, the junction 272 would pull away from the outer shielding conductor130 of the probing tip 108.

FIGS. 8A and 8B illustrates further embodiments of the ground clipsystem 102. Like elements from the previous drawings are labeled thesame in FIGS. 8A and 8B. The views in FIGS. 8A and 8B are lookingparallel to the lateral section 260. In FIG. 8A, the spring wire member250 is modified so that the substantially vertical section 262 is angledrelative to a common plane 280 containing the lateral section 260 andthe angled section 264. The angle of the substantially vertical section262 to the common plane 280 is nominally twenty degrees. The bore 252 inthe retention block 196 is changed from an angled bore of twenty degreesto a vertical bore that is normal to the surface of the retention block196. Alternately, the substantially vertical section 262 may have anangle of less than twenty degrees to the common plane 280 and the bore252 may be angled at less than twenty degrees where the total angle ofthe substantially vertical section 262 and the angled bore 252 is twentydegrees.

In FIG. 8B, the spring wire member 250 is modified so that the angledsection 264 is angled relative to a common plane 282 containing thelateral section 260 and the substantially vertical section 262. Theangle of the angled section 264 to the common plane 282 is nominallytwenty degrees. The bore 252 in the retention block 196 is changed froman angled bore of twenty degrees to a vertical bore that is normal tothe surface of the retention block 196.

The differential measurement probe 10 and the differential TDRmeasurement probe 100 with the ground clip systems 12, 102 provide avirtual ground to the signals being measured by the probe. The use ofthe ground clip systems 12, 102 achieves greater bandwidth into the 20GHz range than previous differential measurement probes.

It will be obvious to those having skill in the art that many changesmay be made to the details of the above-described embodiments of thisinvention without departing from the underlying principles thereof. Thescope of the present invention should, therefore, be determined only bythe following claims.

1. In a differential measurement probe having first and secondmeasurement probing tips extending from one end of the differentialmeasurement probe and laying in a common vertical plane with the firstand second measurement probing tips moving axially and laterallyrelative to each other, a ground clip system for electrically couplingshielding conductors of the first and second measurement probing tipstogether comprising: a circular spring wire having a lateral sectionthat transitions into a substantially vertical section at one end and anangled section at the other end with the angled section extending in theopposite direction from the substantially vertical section and having anangle to the lateral section with the lateral section and the angledsection being in a common plane and the substantially vertical sectionhaving an acute angle relative to the common plane, and a protrudingsection extending upward from the end of the angled section with theprotruding section having an acute angle to the to the common plane, anda flattened wire section extending from the end of the protrudingsection with the flattened section extending toward the common plane andhaving an obtuse angle relative to the lateral section of the circularspring wire and an acute angle relative to the lateral section plane; anbore formed in the end of the differential measurement probe parallel tothe common vertical plane of the first and second measurement probingtips receiving the substantially vertical section of the circular springwire; and a protrusion having side surfaces extending upward from theend of the differential measurement probe adjacent to one of themeasurement probing tips with the end of the lateral section of thecircular spring wire adjacent to the angled section of the circularspring wire abutting the surface of the protrusion facing themeasurement probing tip such that the junction of the angled section andthe protruding section of the circular spring wire engages one of theshielding conductors of the first and second measurement probing tipsand the flattened section of the circular spring wire engages theshielding conductor of the other of the first and second measurementprobing tips.
 2. The ground clip system as recited in claim 1 whereinthe acute angle of the substantially vertical section of the circularspring wire is at twenty degrees to the common plane.